Introduction of highly integrated packages such as the Ball Grid Array BGA and the shrinking outlines of modern electronic gadgets have reduced the available space for the PCB as well To pack more circuitry within the limited space designers now use micro vias These are extremely small diameter vias which are often placed on pads and tracks giving more space to the designer to route their traces Vias placed on pads or tracks are electroplated and often filled and covered with copper

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Introduction of highly integrated packages such as the Ball Grid Array (BGA), and the shrinking outlines of modern electronic gadgets have reduced the available space for the PCB as well. To pack more circuitry within the limited space designers now use micro-vias. These are extremely small diameter vias, which are often placed on pads and tracks giving more space to the designer to route their traces. Vias placed on pads or tracks are electroplated and often filled and covered with copper.

#bePCBwise #MakePCBInAmerica #connectorarea #pcbs #pcbpowerinc #pcb #printedcircuitboard #pcbfabrication #pcbmanufacturing #engineers #engineering #PCBDesign #printedcircuitboards #manufacturingprocess #madeinamerica #pcbmadeinusa

Introduction of highly integrated packages such as the Ball Grid Array (BGA), and the shrinking outlines of modern electronic gadgets have reduced the available space for the PCB as well. To pack more circuitry within the limited space designers now use micro-vias. These are extremely small diameter vias, which are often placed on pads and tracks giving more space to the designer to route their traces. Vias placed on pads or tracks are electroplated and often filled and covered with copper. ⠀ #bePCBwise #MakePCBInAmerica #connectorarea #pcbs #pcbpowerinc #pcb #printedcircuitboard #pcbfabrication #pcbmanufacturing #engineers #engineering #PCBDesign #printedcircuitboards #manufacturingprocess #madeinamerica #pcbmadeinusa

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